Yes, it’s definitely possible to design water-cooling blocks for different AI chip sizes. The main challenge is adapting the internal channel layout and contact surface so the heat transfer stays efficient for each chip package. I’ve seen some great custom CNC and 3D-milled designs that work really well for high-load AI hardware. When I recently wrote about a similar cooling concept, I used Clever Free AI Humanizer cleverhumanizer.ai/ai-writer to polish the text. It helped make my technical explanation clearer and more natural for readers